H's 手札

看看最新的拆機吧 XD

其實手機的硬體佈線和使用元件是很有趣的，可以看出很多端倪 ...

Nexus S teardown:

- http://www.ifixit.com/Teardown/Nexus-S-Teardown/4365/1

Galaxy S (GT-9000) teardown:

- http://www.phonewreck.com/2010/08/19/samsung-galaxy-s-teardown/

- http://www.eettaiwan.com/ART_8800625414_675327_NT_ca7a0132.HTM

- http://www.cn.fpdisplay.com/Forecast/Article.aspx?id=a82137de-2eca-4628-9cb0-c943ab4591f2

- http://www.phonewreck.com/wp-content/uploads/2010/08/GSBD11.jpg

iPhone 4 teardown

http://www.ifixit.com/Teardown/iPhone-4-Teardown/3130/1

重要元件:

CPU - S5PC110A01 1GHz Cortex A8 Hummingbird Processor

Samsung 的CPU，業界應該都知道他跟 IPhone4 的A4 應該是同樣的架構

MCP:

Nexus: KB100D00WM-A453 包含 8Gb的OneNand (KFG8GH6Q4M)、2Gb的DDR SDRAM (K4X2G323PB)、1Gb DDR SDRAM (K4X1G323B)、還有一顆不明元件。

Flash:

Nexus S: SanDisk SDIN4C2 16GB MLC NAND flash

iPhone4: Samsung K9PFG08 

Galaxy S: Samsung KLM8G4DEDD moviNAND

Baseband Processor

Nexus S: Infineon 8824 XG616 X-Gold

Galaxy S: Infineon YYN1N7438A8 (X-GOLD 61x ?)

IPhone 4: Infineon X-GOLD 61x

E-Compass

iPhone4: AKM8975

Touch

Nexus S: Atmel MXT224 
iPhone4: TI 343S0499 Touch Screen Controller